Electrolytic Copper Powder-Dendritic:
Parameters | Particle Size - Dry Sieve |
AD (g/cc) |
Copper content (%) |
Application | |||||
>150 µm (%) |
>106 µm (%) |
>75 µm (%) |
>63 µm (%) |
>45 µm (%) |
Pan (%) |
||||
|
(IS-5461) |
(ASTM B-212 / B-417) |
(ASTM E-53) | ||||||
EC 1 | -- | -- | 1 max | -- | Bal | 90 min | 1.2 - 1.7 | 98.3 min | |
EC 2 | -- | 1 max | -- | Bal | -- | 90 min | 1.3 - 2.0 | 98.5 min | |
EC 3 | -- | -- | -- | -- | Bal | 20 - 35 | 2.0 - 3.3 | 98.8 min | |
EC 5 | Bal | -- | -- | -- | -- | 15 max | 2.3 - 3.5 | 99.0 min | |
EC 6 | 5 max | -- | -- | -- | Bal | 15 - 30 | 2.3 - 3.5 | 98.8 min |
The flow rate of EC3, EC5 and EC6 is 25 - 50 sec/50 g.
The sieve value of each sieve is the retention after passing through its previous sieve.
Dendritic Shape
(Used for Abrasives, Automobile parts, Brake linings, Contact Materials, Carbon blocks & brushes, Chemicals, Conductive adhesive materials, Conductive silver coated copper powder products, Diamond tools, Electromagnetic shielding, Friction components, Grinding wheels, Industrial lubricants, Metal injection molding, Pesticides, Powder metallurgy parts, Sintering parts, Welding electrodes applications etc.)