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METAL POWDER PRODUCTS

ELECTROLYTIC COPPER POWDER


Electrolytic Copper Powder-Dendritic:

Parameters Particle Size - Dry Sieve AD

(g/cc)
Copper content

(%)
Application
>150
µm
(%)
>106
µm
(%)
>75
µm
(%)
>63
µm
(%)
>45
µm
(%)
Pan

(%)
 
Test Methods Trade Mark
(IS-5461) (ASTM B-212 /
B-417)
(ASTM E-53)
EC 1 -- -- 1 max -- Bal 90 min 1.2 - 1.7 98.3 min
EC 2 -- 1 max -- Bal -- 90 min 1.3 - 2.0 98.5 min
EC 3 -- -- -- -- Bal 20 - 35 2.0 - 3.3 98.8 min
EC 5 Bal -- -- -- -- 15 max 2.3 - 3.5 99.0 min
EC 6 5 max -- -- -- Bal 15 - 30 2.3 - 3.5 98.8 min

The flow rate of EC3, EC5 and EC6 is 25 - 50 sec/50 g.

The sieve value of each sieve is the retention after passing through its previous sieve.
Dendritic Shape

(Used for Abrasives, Automobile parts, Brake linings, Contact Materials, Carbon blocks & brushes, Chemicals, Conductive adhesive materials, Conductive silver coated copper powder products, Diamond tools, Electromagnetic shielding, Friction components, Grinding wheels, Industrial lubricants, Metal injection molding, Pesticides, Powder metallurgy parts, Sintering parts, Welding electrodes applications etc.)